Method and system for forming patterns with charged particle beam lithography

ABSTRACT

In a method for fracturing or mask data preparation or mask process correction for charged particle beam lithography, a plurality of shots are determined that will form a pattern on a surface, where shots are determined so as to reduce sensitivity of the resulting pattern to changes in beam blur (β f ). In some embodiments, the sensitivity to changes in β f  is reduced by varying the charged particle surface dosage for a portion of the pattern. Methods for forming patterns on a surface, and for manufacturing an integrated circuit are also disclosed, in which pattern sensitivity to changes in β f  is reduced.

RELATED APPLICATIONS

This application is a continuation-in-part of U.S. patent applicationSer. No. 13/168,953 filed on Jun. 25, 2011 entitled “Method and SystemFor Forming Patterns With Charged Particle Beam Lithography”, which isrelated to U.S. patent application Ser. No. 13/168,954 filed on Jun. 25,2011 entitled “Method and System for Forming High Accuracy PatternsUsing Charged Particle Beam Lithography”; both of which are herebyincorporated by reference for all purposes.

BACKGROUND OF THE DISCLOSURE

In the production or manufacturing of semiconductor devices, such asintegrated circuits, optical lithography may be used to fabricate thesemiconductor devices. Optical lithography is a printing process inwhich a lithographic mask or photomask manufactured from a reticle isused to transfer patterns to a substrate such as a semiconductor orsilicon wafer to create the integrated circuit (I.C.). Other substratescould include flat panel displays, holographic masks, or even otherreticles. While conventional optical lithography uses a light sourcehaving a wavelength of 193 nm, extreme ultraviolet (EUV) or X-raylithography are also considered types of optical lithography in thisapplication. The reticle or multiple reticles may contain a circuitpattern corresponding to an individual layer of the integrated circuit,and this pattern can be imaged onto a certain area on the substrate thathas been coated with a layer of radiation-sensitive material known asphotoresist or resist. Once the patterned layer is transferred the layermay undergo various other processes such as etching, ion-implantation(doping), metallization, oxidation, and polishing. These processes areemployed to finish an individual layer in the substrate. If severallayers are required, then the whole process or variations thereof willbe repeated for each new layer. Eventually, a combination of multiplesof devices or integrated circuits will be present on the substrate.These integrated circuits may then be separated from one another bydicing or sawing and then may be mounted into individual packages. Inthe more general case, the patterns on the substrate may be used todefine artifacts such as display pixels, holograms, directedself-assembly (DSA) guard bands, or magnetic recording heads.Conventional optical lithography writing machines typically reduce thephotomask pattern by a factor of four during the optical lithographicprocess. Therefore, patterns formed on the reticle or mask must be fourtimes larger than the size of the desired pattern on the substrate orwafer.

In the production or manufacturing of semiconductor devices, such asintegrated circuits, non-optical methods may be used to transfer apattern on a lithographic mask to a substrate such as a silicon wafer.Nanoimprint lithography (NIL) is an example of a non-optical lithographyprocess. In nanoimprint lithography, a lithographic mask pattern istransferred to a surface through contact of the lithography mask withthe surface.

In the production or manufacturing of semiconductor devices, such asintegrated circuits, maskless direct write may also be used to fabricatethe semiconductor devices. Maskless direct write is a printing processin which charged particle beam lithography is used to transfer patternsto a substrate such as a semiconductor or silicon wafer to create theintegrated circuit. Other substrates could include flat panel displays,imprint masks for nano-imprinting, or even reticles. Desired patterns ofa layer are written directly on the surface, which in this case is alsothe substrate. Once the patterned layer is transferred the layer mayundergo various other processes such as etching, ion-implantation(doping), metallization, oxidation, and polishing. These processes areemployed to finish an individual layer in the substrate. If severallayers are required, then the whole process or variations thereof willbe repeated for each new layer. Some of the layers may be written usingoptical or non-optical lithography while others may be written usingmaskless direct write to fabricate the same substrate. Also, somepatterns of a given layer may be written using optical or non-opticallithography, and other patterns written using maskless direct write.Eventually, a combination of multiples of devices or integrated circuitswill be present on the substrate. These integrated circuits are thenseparated from one another by dicing or sawing and then mounted intoindividual packages. In the more general case, the patterns on thesurface may be used to define artifacts such as display pixels,holograms, or magnetic recording heads.

Two common types of charged particle beam lithography are variableshaped beam (VSB) and character projection (CP). These are bothsub-categories of shaped beam charged particle beam lithography, inwhich a precise electron beam is shaped and steered so as to expose aresist-coated surface, such as the surface of a wafer or the surface ofa reticle. In VSB, these shapes are simple shapes, usually limited torectangles of certain minimum and maximum sizes and with sides which areparallel to the axes of a Cartesian coordinate plane (i.e. of“Manhattan” orientation), and 45 degree right triangles (i.e. triangleswith their three internal angles being 45 degrees, 45 degrees, and 90degrees) of certain minimum and maximum sizes. At predeterminedlocations, doses of electrons are shot into the resist with these simpleshapes. The total writing time for this type of system increases withthe number of shots. In character projection (CP), there is a stencil inthe system that has in it a variety of apertures or characters which maybe complex shapes such as rectilinear, arbitrary-angled linear,circular, nearly circular, annular, nearly annular, oval, nearly oval,partially circular, partially nearly circular, partially annular,partially nearly annular, partially nearly oval, or arbitrarycurvilinear shapes, and which may be a connected set of complex shapesor a group of disjointed sets of a connected set of complex shapes. Anelectron beam can be shot through a character on the stencil toefficiently produce more complex patterns on the reticle. In theory,such a system can be faster than a VSB system because it can shoot morecomplex shapes with each time-consuming shot. Thus, an E-shaped patternshot with a VSB system takes four shots, but the same E-shaped patterncan be shot with one shot with a character projection system. Note thatVSB systems can be thought of as a special (simple) case of characterprojection, where the characters are just simple characters, usuallyrectangles or 45-45-90 degree triangles. It is also possible topartially expose a character. This can be done by, for instance,blocking part of the particle beam. For example, the E-shaped patterndescribed above can be partially exposed as an F-shaped pattern or anI-shaped pattern, where different parts of the beam are cut off by anaperture. This is the same mechanism as how various sized rectangles canbe shot using VSB. In this disclosure, partial projection is used tomean both character projection and VSB projection. Shaped beam chargedparticle beam lithography may use either a single shaped beam, or mayuse a plurality of shaped beams simultaneously exposing the surface, theplurality of shaped beams producing a higher writing speed than a singleshaped beam.

As indicated, in lithography the lithographic mask or reticle comprisesgeometric patterns corresponding to the circuit components to beintegrated onto a substrate. The patterns used to manufacture thereticle may be generated utilizing computer-aided design (CAD) softwareor programs. In designing the patterns the CAD program may follow a setof pre-determined design rules in order to create the reticle. Theserules are set by processing, design, and end-use limitations. An exampleof an end-use limitation is defining the geometry of a transistor in away in which it cannot sufficiently operate at the required supplyvoltage. In particular, design rules can define the space tolerancebetween circuit devices or interconnect lines. The design rules are, forexample, used to ensure that the circuit devices or lines do notinteract with one another in an undesirable manner. For example, thedesign rules are used so that lines do not get too close to each otherin a way that may cause a short circuit. The design rule limitationsreflect, among other things, the smallest dimensions that can bereliably fabricated. When referring to these small dimensions, oneusually introduces the concept of a critical dimension. These are, forinstance, defined as the smallest width of a line or the smallest spacebetween two lines, those dimensions requiring exquisite control.

One goal in integrated circuit fabrication by optical lithography is toreproduce the original circuit design on the substrate by use of thereticle. Integrated circuit fabricators are always attempting to use thesemiconductor wafer real estate as efficiently as possible. Engineerskeep shrinking the size of the circuits to allow the integrated circuitsto contain more circuit elements and to use less power. As the size ofan integrated circuit critical dimension is reduced and its circuitdensity increases, the critical dimension of the circuit pattern orphysical design approaches the resolution limit of the optical exposuretool used in conventional optical lithography. As the criticaldimensions of the circuit pattern become smaller and approach theresolution value of the exposure tool, the accurate transcription of thephysical design to the actual circuit pattern developed on the resistlayer becomes difficult. To further the use of optical lithography totransfer patterns having features that are smaller than the lightwavelength used in the optical lithography process, a process known asoptical proximity correction (OPC) has been developed. OPC alters thephysical design to compensate for distortions caused by effects such asoptical diffraction and the optical interaction of features withproximate features. OPC includes all resolution enhancement technologiesperformed with a reticle.

OPC may add sub-resolution lithographic features to mask patterns toreduce differences between the original physical design pattern, thatis, the design, and the final transferred circuit pattern on thesubstrate. The sub-resolution lithographic features interact with theoriginal patterns in the physical design and with each other andcompensate for proximity effects to improve the final transferredcircuit pattern. One feature that is used to improve the transfer of thepattern is a sub-resolution assist feature (SRAF). Another feature thatis added to improve pattern transference is referred to as “serifs”.Serifs are small features that can be positioned on an interior orexterior corner of a pattern to sharpen the corner in the finaltransferred image. It is often the case that the precision demanded ofthe surface manufacturing process for SRAFs is less than the precisiondemanded for patterns that are intended to print on the substrate, oftenreferred to as main features. Serifs are a part of a main feature. Asthe limits of optical lithography are being extended far into thesub-wavelength regime, the OPC features must be made more and morecomplex in order to compensate for even more subtle interactions andeffects. As imaging systems are pushed closer to their limits, theability to produce reticles with sufficiently fine OPC features becomescritical. Although adding serifs or other OPC features to a mask patternis advantageous, it also substantially increases the total feature countin the mask pattern. For example, adding a serif to each of the cornersof a square using conventional techniques adds eight more rectangles toa mask or reticle pattern. Adding OPC features is a very laborious task,requires costly computation time, and results in more expensivereticles. Not only are OPC patterns complex, but since optical proximityeffects are long range compared to minimum line and space dimensions,the correct OPC patterns in a given location depend significantly onwhat other geometry is in the neighborhood. Thus, for instance, a lineend will have different size serifs depending on what is near it on thereticle. This is even though the objective might be to produce exactlythe same shape on the wafer. These slight but critical variations areimportant and have prevented others from being able to form reticlepatterns. It is conventional to discuss the OPC-decorated patterns to bewritten on a reticle in terms of main features, that is features thatreflect the design before OPC decoration, and OPC features, where OPCfeatures might include serifs, jogs, and SRAF. To quantify what is meantby slight variations, a typical slight variation in OPC decoration fromneighborhood to neighborhood might be 5% to 80% of a main feature size.Note that for clarity, variations in the design of the OPC are what isbeing referenced. Manufacturing variations such as corner rounding willalso be present in the actual surface patterns. When these OPCvariations produce substantially the same patterns on the wafer, what ismeant is that the geometry on the wafer is targeted to be the samewithin a specified error, which depends on the details of the functionthat that geometry is designed to perform, e.g., a transistor or a wire.Nevertheless, typical specifications are in the 2%-50% of a main featurerange. There are numerous manufacturing factors that also causevariations, but the OPC component of that overall error is often in therange listed. OPC shapes such as sub-resolution assist features aresubject to various design rules, such as a rule based on the size of thesmallest feature that can be transferred to the wafer using opticallithography. Other design rules may come from the mask manufacturingprocess or, if a character projection charged particle beam writingsystem is used to form the pattern on a reticle, from the stencilmanufacturing process. It should also be noted that the accuracyrequirement of the SRAF features on the mask may be lower than theaccuracy requirements for the main features on the mask. As processnodes continue to shrink, the size of the smallest SRAFs on a photomaskalso shrinks. For example, at the 20 nm logic process node, 40 nm to 60nm SRAFs are needed on the mask for the highest precision layers.

Inverse lithography technology (ILT) is one type of OPC technique. ILTis a process in which a pattern to be formed on a reticle is directlycomputed from a pattern which is desired to be formed on a substratesuch as a silicon wafer. This may include simulating the opticallithography process in the reverse direction, using the desired patternon the substrate as input. ILT-computed reticle patterns may be purelycurvilinear—i.e. completely non-rectilinear—and may include circular,nearly circular, annular, nearly annular, oval and/or nearly ovalpatterns. Since these ideal ILT curvilinear patterns are difficult andexpensive to form on a reticle using conventional techniques,rectilinear approximations or rectilinearizations of the curvilinearpatterns may be used. The rectilinear approximations decrease accuracy,however, compared to the ideal ILT curvilinear patterns. Additionally,if the rectilinear approximations are produced from the ideal ILTcurvilinear patterns, the overall calculation time is increased comparedto ideal ILT curvilinear patterns. In this disclosure ILT, OPC, sourcemask optimization (SMO), and computational lithography are terms thatare used interchangeably.

EUV optical lithography has a much higher resolution than conventionaloptical lithography. The very high resolution of EUV significantlyreduces the need for OPC processing, resulting in lower mask complexityfor EUV than for 193 nm optical lithography. However, because of thevery high resolution of EUV, imperfections in a photomask, such asexcessive line edge roughness (LER), will be transferred to the wafer.Therefore, the accuracy requirements for EUV masks are higher than thosefor conventional optical lithography. Additionally, even though EUV maskshapes are not complicated by the addition of complex SRAFs or serifsrequired for conventional 193 nm lithography, EUV mask shapes arecomplicated by an addition of some complexities unique to EUVmanufacturing. Of particular relevance in writing patterns on masks forEUV lithography is mid-range scattering of charged particles such aselectrons, which may affect a radius of about 2 um. This midrangescattering introduces a new consideration for mask data preparation,because for the first time the influence from neighboring patterns hassignificant impact on the shape that a particular pattern would castonto the mask surface. Previously, when exposing masks for use withconventional 193 nm lithography, the short-range scattering affectedonly the pattern being written, and the long-range scattering had alarge enough effective range that only the size of a pattern, and notits detailed shape, was affected, making it possible to make correctionsby only using dose modulation. In addition, since EUV processing ofwafers is more expensive, it is desirable to reduce or eliminatemultiple patterning. Multiple patterning is used in conventional opticallithography to allow exposure of small features by exposing patterns forone layer of wafer processing using multiple masks, each of whichcontains a portion of the layer pattern. Reducing or eliminatingmultiple exposures requires the single mask to contain more finepatterns. For example, a series of collinear line segments maybedouble-patterned by first drawing a long line, then cutting the lineinto line segments by a second mask in conventional lithography. Thesame layer written with a single mask, such as for EUV lithography,would require a mask containing many smaller line segments. The need towrite larger numbers of finer patterns on a single mask, each patternneeding to be more accurate, increases the need for precision on EUVmasks.

There are a number of technologies used for forming patterns on areticle, including using optical lithography or charged particle beamlithography. The most commonly used system is the variable shaped beam(VSB), where, as described above, doses of electrons with simple shapessuch as Manhattan rectangles and 45-degree right triangles expose aresist-coated reticle surface. In conventional mask writing, the dosesor shots of electrons are designed to avoid overlap wherever possible,so as to greatly simplify calculation of how the resist on the reticlewill register the pattern. Similarly, the set of shots is designed so asto completely cover the pattern area that is to be formed on thereticle. U.S. Pat. No. 7,754,401, owned by the assignee of the presentpatent application and incorporated by reference for all purposes,discloses a method of mask writing in which intentional shot overlap forwriting patterns is used. When overlapping shots are used, chargedparticle beam simulation can be used to determine the pattern that theresist on the reticle will register. Use of overlapping shots may allowpatterns to be written with reduced shot count or higher accuracy orboth. U.S. Pat. No. 7,754,401 also discloses use of dose modulation,where the assigned dosages of shots vary with respect to the dosages ofother shots. The term model-based fracturing is used to describe theprocess of determining shots using the techniques of U.S. Pat. No.7,754,401.

Reticle writing for the most advanced technology nodes typicallyinvolves multiple passes of charged particle beam writing, a processcalled multi-pass exposure, whereby the given shape on the reticle iswritten and overwritten. Typically, two to four passes are used to writea reticle to average out precision errors in the charged particle beamwriter, allowing the creation of more accurate photomasks. Alsotypically, the list of shots, including the dosages, is the same forevery pass. In one variation of multi-pass exposure, the lists of shotsmay vary among exposure passes, but the union of the shots in anyexposure pass covers the same area. Multi-pass writing can reduceover-heating of the resist coating the surface. Multi-pass writing alsoaverages out random errors of the charged particle beam writer.Multi-pass writing using different shot lists for different exposurepasses can also reduce the effects of certain systemic errors in thewriting process.

Current optical lithography writing machines typically reduce thephotomask pattern by a factor of four during the optical lithographicprocess. Therefore, patterns formed on a reticle or mask must be fourtimes larger than the size of the desired pattern on the substrate orwafer.

Manufacturing variations can cause variation in the size and shape of apattern manufactured on a surface such as a wafer or reticle using agiven set of charged particle beam lithography shots. Manufacturingvariations may, for example, cause variation in critical dimensions (CD)of the manufactured pattern. Sources of this manufacturing variationinclude variation in particle beam intensity, unintended variation inexposure time and variation in resist sensitivity. The term dose margindescribes the tolerance of a pattern defined by a set of chargedparticle beam shots to dosage-related manufacturing variations. A higherdose margin indicates a higher tolerance.

Dose margin is a typical measure for manufacturing tolerance. But thereare other sources of manufacturing variation. In a world whereoverlapped or dose-modulated shots are used, sensitivity to beam blur orβ_(f), which includes the physical effects of forward scattering,Coulomb effect and resist diffusion, can also be an issue.

SUMMARY OF THE DISCLOSURE

A method for fracturing or mask data preparation or mask processcorrection for charged particle beam lithography is disclosed in which aplurality of shots are determined that will form a pattern on a surface,where shots are determined so as to reduce sensitivity of the resultingpattern to changes in β_(f). In some embodiments, the sensitivity tochanges in β_(f) is reduced by varying the charged particle surfacedosage for a portion of the pattern.

Methods for forming patterns on a surface, and for manufacturing anintegrated circuit are also disclosed, in which pattern sensitivity tochanges in β_(f) is reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an example of a charged particle beam system;

FIG. 2 illustrates an example of an electro-optical schematic diagram ofa multi-beam exposure system;

FIG. 3A illustrates an example of a rectangular shot;

FIG. 3B illustrates an example of a circular character projection shot;

FIG. 3C illustrates an example of a trapezoidal shot;

FIG. 3D illustrates an example of a dragged shot;

FIG. 3E illustrates an example of a shot which is an array of circularpatterns;

FIG. 3F illustrates an example of a shot which is a sparse array ofrectangular patterns;

FIG. 4 illustrates an example of a multi-beam charged particle beamsystem;

FIG. 5A illustrates an example of a rectangular pattern which is desiredto be formed on a surface;

FIG. 5B illustrates an example of corner rounding when forming thepattern of FIG. 5A on a surface;

FIG. 6A illustrates an another example of a pattern which is desired tobe formed on a surface;

FIG. 6B illustrates an example of corner rounding when forming thepattern of FIG. 6A on a surface;

FIG. 7A illustrates an example of a circular pattern which is desired tobe formed on a surface;

FIG. 7B illustrates an example of a set of conventional non-overlappingVSB shots that can form the circular pattern of FIG. 7A;

FIG. 7C illustrates the set of shots of FIG. 7B, overlaid with thecircular pattern of FIG. 7A;

FIG. 8A illustrates an example of a set of overlapping VSB shots whichcan form the circular pattern of FIG. 7A;

FIG. 8B illustrates the set of shots of FIG. 8A, overlaid with thecircular pattern of FIG. 7A;

FIG. 9 illustrates an example of a graph relationship between patternarea and β_(f) for two set of shots;

FIG. 10A illustrates an exemplary set of overlapping VSB shots which canform the circular pattern of FIG. 7A according to the current invention;

FIG. 10B illustrates the set of shots of FIG. 10A, overlaid with thecircular pattern of FIG. 7A;

FIG. 10C illustrates another exemplary set of overlapping VSB shotswhich can form the circular pattern of FIG. 7A according to the currentinvention;

FIG. 10D illustrates the set of shots of FIG. 10C, overlaid with thecircular pattern of FIG. 7A;

FIG. 11 illustrates an example of a graph relationship between patternarea and β_(f) for four set of shots;

FIG. 12 illustrates an embodiment of a conceptual flow diagram of how toprepare a surface in fabricating a substrate such as an integratedcircuit on a silicon wafer;

FIG. 13 illustrates an embodiment of a conceptual flow diagram of how toprepare a surface in fabricating a substrate such as an integratedcircuit on a silicon wafer; and

FIG. 14 illustrates an exemplary computing hardware device used inembodiments of the methods.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The present disclosure is related to lithography, and more particularlyto the design and manufacture of a surface which may be a reticle, awafer, or any other surface, using charged particle beam lithography.

The improvements and advantages of the present disclosure can beaccomplished by controlling the parameters of the shots forming apattern, so as to reduce the magnitude of pattern variations caused byvariation of β_(f), thereby allowing higher quality patterns to beformed on reticles and other surfaces such as wafers. In someembodiments, shot dosage, including multi-beam shot beamlet dosage, isvaried to reduce sensitivity to changes in β_(f). In other embodiments,the amount of shot overlap in a plurality of shots may be controlled,either during initial shot determination, or in a post-processing step,to reduce sensitivity to changes in β_(f). In some embodiments, thesensitivity comprises pattern area sensitivity of the pattern formed onthe surface. The reduced sensitivity to changes in β_(f) expands theprocess window for the charged particle beam lithography process.

Referring now to the drawings, wherein like numbers refer to like items,FIG. 1 illustrates an embodiment of a lithography system, such as acharged particle beam writer system, in this case an electron beamwriter system 10, that employs a variable shaped beam (VSB) tomanufacture a surface 12. The electron beam writer system 10 has anelectron beam source 14 that projects an electron beam 16 toward anaperture plate 18. The plate 18 has an aperture 20 formed therein whichallows the electron beam 16 to pass. Once the electron beam 16 passesthrough the aperture 20 it is directed or deflected by a system oflenses (not shown) as electron beam 22 toward another rectangularaperture plate or stencil mask 24. The stencil 24 has formed therein anumber of openings or apertures 26 that define various simple shapessuch as rectangles and triangles. Each aperture 26 formed in the stencil24 may be used to form a pattern in the surface 12 of a substrate 34,such as a silicon wafer, a reticle or other substrate. An electron beam30 emerges from one of the apertures 26 and passes through anelectromagnetic or electrostatic reduction lens 38, which reduces thesize of the pattern emerging from the aperture 26. In commonly availablecharged particle beam writer systems, the reduction factor is between 10and 60. The reduced electron beam 40 emerges from the reduction lens 38and is directed by a series of deflectors 42 onto the surface 12 as apattern 28. The surface 12 is coated with resist (not shown) whichreacts with the electron beam 40. The electron beam 22 may be directedto overlap a variable portion of an aperture 26, affecting the size andshape of the pattern 28. Blanking plates (not shown) are used to deflectthe beam 16 or the shaped beam 22 so to prevent the electron beam fromreaching the surface 12 during a period after each shot when the lensesdirecting the beam 22 and the deflectors 42 are being re-adjusted forthe succeeding shot. Typically the blanking plates are positioned so asto deflect the electron beam 16 to prevent it from illuminating aperture20. Conventionally, the blanking period may be a fixed length of time,or it may vary depending, for example, on how much the deflector 42 mustbe re-adjusted for the position of the succeeding shot.

In electron beam writer system 10, the substrate 34 is mounted on amovable platform or stage 32. The stage 32 allows substrate 34 to berepositioned so that patterns which are larger than the maximumdeflection capability or field size of the charged particle beam 40 maybe written to surface 12 in a series of subfields, where each subfieldis within the capability of deflector 42 to deflect the beam 40. In oneembodiment the substrate 34 may be a reticle. In this embodiment, thereticle, after being exposed with the pattern, undergoes variousmanufacturing steps through which it becomes a lithographic mask orphotomask. The mask may then be used in an optical lithography machineto project an image of the reticle pattern 28, generally reduced insize, onto a silicon wafer to produce an integrated circuit. Moregenerally, the mask is used in another device or machine to transfer thepattern 28 on to a substrate (not illustrated).

A charged particle beam system may expose a surface with a plurality ofindividually-controllable beams or beamlets. FIG. 2 illustrates anelectro-optical schematic diagram in which there are three chargedparticle beamlets 210. Associated with each beamlet 210 is a beamcontroller 220. Each beam controller 220 can, for example, allow itsassociated beamlet 210 to strike surface 230, and can also preventbeamlet 210 from striking the surface 230. In some embodiments, beamcontroller 220 may also control beam blur, magnification, size and/orshape of beamlet 210. In this disclosure, a charged particle beam systemwhich has a plurality of individually-controllable beamlets is called amulti-beam system. In some embodiments, charged particles from a singlesource may be sub-divided to form a plurality of beamlets 210. In otherembodiments a plurality of sources may be used to create the pluralityof beamlets 210. In some embodiments, beamlets 210 may be shaped by oneor more apertures, whereas in other embodiments there may be noapertures to shape the beamlets. Each beam controller 220 may allow theperiod of exposure of its associated beamlet to be controlledindividually. Generally the beamlets will be reduced in size by one ormore lenses (not shown) before striking the surface 230, which willtypically be coated with a resist. In some embodiments each beamlet mayhave a separate electro-optical lens, while in other embodiments aplurality of beamlets, including possibly all beamlets, will share anelectro-optical lens.

For purposes of this disclosure, a shot is the exposure of some surfacearea over a period of time. The area may be comprised of multiplediscontinuous smaller areas. A shot may be comprised of a plurality ofother shots which may or may not overlap, and which may or may not beexposed simultaneously. A shot may comprise a specified dose, or thedose may be unspecified. Shots may use a shaped beam, an unshaped beam,or a combination of shaped and unshaped beams. FIG. 3 illustrates somevarious types of shots. FIG. 3A illustrates an example of a rectangularshot 310. A VSB charged particle beam system can, for example, formrectangular shots in a variety of x and y dimensions. FIG. 3Billustrates an example of a character projection (CP) shot 320, which iscircular in this example. FIG. 3C illustrates an example of atrapezoidal shot 330. In one embodiment, shot 330 may be a created usinga raster-scanned charged particle beam, where the beam is scanned, forexample, in the x-direction as illustrated with scan lines 332. FIG. 3Dillustrates an example of a dragged shot 340, disclosed in U.S. PatentApplication Publication 2011-0089345. Shot 340 is formed by exposing thesurface with a curvilinear shaped beam 342 at an initial referenceposition 344, and then moving the shaped beam across the surface fromposition 344 to position 346. A dragged shot path may be, for example,linear, piecewise linear, or curvilinear.

FIG. 3E illustrates an example of a shot 350 that is an array ofcircular patterns 352. Shot 350 may be formed in a variety of ways,including multiple shots of a single circular CP character, one or moreshots of a CP character which is an array of circular apertures, and oneor more multi-beam shots using circular apertures. FIG. 3F illustratesan example of a shot 360 that is a sparse array of rectangular patterns362 and 364. Shot 360 may be formed in a variety of ways, including aplurality of VSB shots, a CP shot, and one or more multi-beam shotsusing rectangular apertures. In some embodiments of multi-beam, shot 360may comprise a plurality of interleaved groups of other multi-beamshots. For example, patterns 362 may be shot simultaneously, thenpatterns 364 may be shot simultaneously at a time different frompatterns 362.

FIG. 4 illustrates an embodiment of a charged particle beam exposuresystem 400. Charged particle beam system 400 is a multi-beam system, inwhich a plurality of individually-controllable shaped beams cansimultaneously expose a surface. Multi-beam system 400 has an electronbeam source 402 that creates an electron beam 404. The electron beam 404is directed toward aperture plate 408 by condenser 406, which mayinclude electrostatic and/or magnetic elements. Aperture plate 408 has aplurality of apertures 410 which are illuminated by electron beam 404,and through which electron beam 404 passes to form a plurality of shapedbeamlets 436. In some embodiments, aperture plate 408 may have hundredsor thousands of apertures 410. Although FIG. 4 illustrates an embodimentwith a single electron beam source 402, in other embodiments apertures410 may be illuminated by electrons from a plurality of electron beamsources. Apertures 410 may be rectangular, or may be of a differentshape, for example circular. The set of beamlets 436 then illuminates ablanking controller plate 432. The blanking controller plate 432 has aplurality of blanking controllers 434, each of which is aligned with abeamlet 436. Each blanking controller 434 can individually control itsassociated beamlet 436, so as to either allow the beamlet 436 to strikesurface 424, or to prevent the beamlet 436 from striking the surface424. The amount of time for which the beam strikes the surface controlsthe total energy or “dose” applied by that beamlet. Therefore, the doseof each beamlet may be independently controlled.

In FIG. 4 beamlets that are allowed to strike surface 424 areillustrated as beamlets 412. In one embodiment, the blanking controller434 prevents its beamlet 436 from striking the surface 424 by deflectingbeamlet 436 so that it is stopped by an aperture plate 416 whichcontains an aperture 418. In some embodiments, blanking plate 432 may bedirectly adjacent to aperture plate 408. In other embodiments, therelative locations of aperture plate 408 and blanking controller 432 maybe reversed from the position illustrated in FIG. 4, so that beam 404strikes the plurality of blanking controllers 434. A system of lensescomprising elements 414, 420, and 422 allows projection of the pluralityof beamlets 412 onto surface 424 of substrate 426, typically at areduced size compared to the plurality of apertures 410. Thereduced-size beamlets form a beamlet group 440 which strikes the surface424 to form a pattern that matches a pattern of a subset of apertures410, the subset being those apertures 410 for which correspondingblanking controllers 434 allow beamlets 436 to strike surface 424. InFIG. 4, beamlet group 440 has four beamlets illustrated for forming apattern on surface 424.

Substrate 426 is positioned on movable platform or stage 428, which canbe repositioned using actuators 430. By moving stage 428, beam 440 canexpose an area larger than the dimensions of the maximum size patternformed by beamlet group 440, using a plurality of exposures or shots. Insome embodiments, the stage 428 remains stationary during an exposure,and is then repositioned for a subsequent exposure. In otherembodiments, stage 428 moves continuously and at a variable velocity. Inyet other embodiments, stage 428 moves continuously but at a constantvelocity, which can increase the accuracy of the stage positioning. Forthose embodiments in which stage 428 moves continuously, a set ofdeflectors (not shown) may be used to move the beam to match thedirection and velocity of stage 428, allowing the beamlet group 440 toremain stationary with respect to surface 424 during an exposure. Instill other embodiments of multi-beam systems, individual beamlets in abeamlet group may be deflected across surface 424 independently fromother beamlets in the beamlet group.

Other types of multi-beam systems may create a plurality of unshapedbeamlets 436, such as by using a plurality of charged particle beamsources to create an array of Gaussian beamlets.

Referring again for FIG. 1, the minimum size pattern that can beprojected with reasonable accuracy onto a surface 12 is limited by avariety of short-range physical effects associated with the electronbeam writer system 10 and with the surface 12, which normally comprisesa resist coating on the substrate 34. These effects include forwardscattering, Coulomb effect, and resist diffusion. Beam blur, also calledβ_(f), is a term used to include all of these short-range effects. Themost modern electron beam writer systems can achieve an effective beamblur radius or β_(f) in the range of 20 nm to 30 nm. Forward scatteringmay constitute one quarter to one half of the total beam blur. Modernelectron beam writer systems contain numerous mechanisms to reduce eachof the constituent pieces of beam blur to a minimum. Since somecomponents of beam blur are a function of the calibration level of aparticle beam writer, the β_(f) of two particle beam writers of the samedesign may differ. The diffusion characteristics of resists may alsovary. Variation of β_(f) based on shot size or shot dose can besimulated and systemically accounted for. But there are other effectsthat cannot or are not accounted for, and they appear as randomvariation. Note that in a multi-beam exposure system, the variation ofβ_(f) which can be accounted for includes variation based on the numberof beamlets in a given multi-beam shot, and on the dosage of each of thebeamlets.

The shot dosage of a charged particle beam writer such as an electronbeam writer system is a function of the intensity of the beam source 14and the exposure time for each shot. Typically the beam intensityremains fixed, and the exposure time is varied to obtain variable shotdosages. Different areas in a shot may have different exposure times,such as in a multi-beam shot. The exposure time may be varied tocompensate for various long-range effects such as backscatter, fogging,and loading effects in a process called proximity effect correction(PEC). Electron beam writer systems usually allow setting an overalldosage, called a base dosage, which affects all shots in an exposurepass. Some electron beam writer systems perform dosage compensationcalculations within the electron beam writer system itself, and do notallow the dosage of each shot to be assigned individually as part of theinput shot list, the input shots therefore having unassigned shotdosages. In such electron beam writer systems all shots have the basedosage, before PEC. Other electron beam writer systems do allow dosageassignment on a shot-by-shot basis. In electron beam writer systems thatallow shot-by-shot dosage assignment, the number of available dosagelevels may be 64 to 4096 or more, or there may be a relatively fewavailable dosage levels, such as 3 to 8 levels.

Conventionally, shots are designed so as to completely cover an inputpattern with rectangular shots, while avoiding shot overlap whereverpossible within an exposure pass. Also, all shots are designed to have anormal dosage, which is a dosage at which a relatively large rectangularshot, in the absence of long-range effects, will produce a pattern onthe surface which is the same size as is the shot size. Some electronbeam writer systems enforce this methodology by not allowing shots tooverlap within an exposure pass.

Conventionally-fractured Manhattan shapes having edge lengths of 100 nmor greater are relatively immune to β_(f) variation. This is becauseManhattan edges of desired mask shapes drawn with edges of VSB shots areinsensitive to variation in β_(f). For any designed Manhattan shape,however, the 90 degree corners in the designed shape will not be formedas 90 degree corners on a photomask. Instead, the corners will berounded to a degree determined principally by the value of β_(f). Thecorner-rounded regions are sensitive to β_(f) even inconventionally-fractured shapes. FIG. 5A illustrates an example of arectangular shape 502 that may be desired to be formed on a reticle.FIG. 5B illustrates an example of a shape 522 that may be formed on areticle from shape 502 using a conventional VSB shot. The dimensions ofshape 522 are the same as shape 502, except for the corner regions 524.The corner regions 524 of shape 522 are rounded due to β_(f), comparedto the sharp corners of shape 502. The radius 526 of the corners 524depends on the value of β_(f): a larger β_(f) will produce a largerradius of rounding, and a smaller β_(f) will produce a smaller radius ofrounding.

With the continual advancement in semiconductor technology requiringcreation of photomasks with sub-100 nm features, the consequentrequirement for higher precision means that conventional fracturing,even for Manhattan shapes, becomes increasingly sensitive to dose marginand other manufacturing variation. Furthermore, when the shapes desiredon the masks include small (sub-80 nm) Manhattan jogs, diagonalfeatures, or curvilinear features, conventionally-fractured shapes haveincreased sensitivity to dose margin, β_(f) and other manufacturingvariations. FIG. 6A illustrates an example of a pattern 602 that may bedesired to be formed on a reticle. Pattern 602 may be conventionallyexposed using four VSB shots, including shot 604, shot 606, shot 608,and shot 610. In pattern 602 boundaries between the shots areillustrated using dashed lines. FIG. 6B illustrates a pattern 622 thatmay be formed on a reticle from shape 602 using the set of conventionalVSB shots 604, 606, 608 and 610. As can be seen, corners on pattern 622are rounded due to β_(f), with a similar corner radius as is illustratedin shape 522. The pattern 622, however, is relatively more sensitive toβ_(f) variation than is the shape 522. In other words, the shape ofpattern 622 on the reticle is more heavily affected by variation inβ_(f) than is the shape of pattern 522. One factor causing therelatively greater sensitivity of pattern 622 to β_(f) variationcompared to shape 522 is the relatively smaller size of the shots usedin pattern 622, compared to the shot used in pattern 522.

As indicated above, the edges of Manhattan shapes of 100 nm or greateredge lengths are relatively immune to β_(f) variation when conventionalfracturing using non-overlapping VSB shots is used. By contrast, theadded flexibility of using overlapping shots and/or shots with dosemodulation both increases the opportunity to improve pattern toleranceto manufacturing variation and increases the need to choose, amongavailable solutions, the solution that optimizes for manufacturingvariation.

FIG. 7A illustrates an example of a circular pattern 702 that is desiredto be formed on a resist-coated surface, the pattern having a diameterof 350 nm. Circular patterns may be used, for example, to form contactsor vias between layers in a semiconductor manufacturing process. FIG. 7Billustrates a set of conventional non-overlapping VSB shots 710 whichmay be used to form the pattern 702. The set of shots 710 consists offive shots: shot 714, shot 716, shot 718, shot 720 and shot 722. FIG. 7Cillustrates the set of shots 710 of FIG. 7B overlaid with the circularpattern 702 of FIG. 7A. Conventionally, the shots in set of shots 710will all have the same dosage, before long-range correction is applied.

FIG. 8A illustrates a set of overlapping VSB shots 800 that may also beused to form circular pattern 702. Set of shots 800 consists of sevenshots: shot 802, shot 804, shot 806, shot 808, shot 810, shot 812 andshot 814. For clarity, the areas where shots overlap are shaded withcross-hatching. The dosage of the shots in set of shots 800 may varyfrom shot to shot, before long-range correction. FIG. 8B illustrates theset of shots 800 overlaid with the desired circular pattern 702. Use ofmodel-based fracturing techniques with overlapping shots such as set ofshots 800 may allow formation of patterns of a given accuracy with fewershots, compared to conventional non-overlapping shots, particularly withcurvilinear patterns. Similarly, when pattern accuracy is the primaryobjective, model-based fracturing may be used to form higher qualitypatterns for a given number of shots, compared to conventionalnon-overlapping shots, particularly with curvilinear patterns such ascircular or nearly-circular patterns.

The pattern that will be produced on a surface from a set of chargedparticle beam shots may be determined through simulation techniques. Aset of shots may be simulated for a plurality of values of β_(f) todetermine the sensitivity of the pattern to changes in β_(f). FIG. 9illustrates an example of a graph 900 of the pattern area produced onthe surface for various values of β_(f), for set of shots 710 and forset of shots 800. Curve 912 illustrates a calculated pattern area forset of shots 710. Curve 914 illustrates a calculated pattern area forset of shots 800. As can be seen, a variation of β_(f) between 28 nm and32 nm produces a variation in pattern area for both curve 912 and curve914. The negative slope of curve 912 indicates that set of shots 710produces a reduced pattern area as β_(f) increases. By contrast, thepositive slope of curve 914 indicates that set of shots 800 produces anincreased pattern area as β_(f) increases. The difference between thesign of the slope of curve 912, which is from a set of shots with nooverlap, and the sign of the slope of curve 914, which is from a set ofshots with overlap which produces varying dosage in different parts ofthe pattern, suggests that it may be possible to find a dosagedistribution for which the pattern area is insensitive to uniformvariation in β_(f) for the shots forming the pattern. One embodiment ofthe current invention comprises adjusting the amount of shot overlap soas to reduce the absolute value of the slope of the pattern area curvewith respect to β_(f). For some pattern configurations, a set of shotsmay be generated which produce a nearly zero slope curve, that is where,over some range of values of β_(f), a change in β_(f) produces no changein pattern area. In other embodiments of the invention, patternparameters other than pattern area may be adjusted to be insensitive tovariations of β_(f). In one embodiment, shot overlap may be adjusted toproduce a dosage pattern which produces a surface pattern in which acritical dimension is insensitive to changes in β_(f) over somepre-determined range.

The most significant source of variation of β_(f) across shots is theCoulomb effect, an effect of negatively-charged electrons repellingagainst each other as the beam crosses over. Coulomb effect is an openarea dependent factor, meaning that Coulomb effect depends on the areaof the charged particle beam illuminating the surface for a given shot.A larger area increases Coulomb effect, as more electrons in the beamcreate greater repelling forces. The above described method ofoptimizing is more effective when the underlying E-beam simulationmodels the shot size dependency of β_(f).

FIG. 10A illustrates an exemplary set of shots 1000 which can formpattern 702 on a surface, according one embodiment of the currentinvention. Set of shots 1000 consists of five shots: shot 1002, shot1004, shot 1006, shot 1008 and shot 1010. In FIG. 10A the areas ofoverlap in set of shots 1000 are shaded using cross-hatching. Areas ofoverlap consist of area 1014, area 1016, area 1018 and area 1020. Theamount of overlap in set of shots 1000 is less than that in set of shots800, and the area of relatively high pattern dosage created by set ofshots 1000 is therefore smaller than the area of relatively high patterndosage created by set of shots 800. FIG. 10B illustrates set of shots1000 overlaid with circular pattern 702. FIG. 11 illustrates an exampleof a graph 1100 of pattern area with respect to β_(f), similar to graph900. In graph 1100, curve 1112 corresponds to graph 900 curve 912, whichis the variation of pattern area for set of shots 710. Curve 1114corresponds to graph 900 curve 914, which is the variation of patternarea for set of shots 800. Curve 1116 illustrates an example of thecalculated pattern area with respect to variation of β_(f) for set ofshots 1000. As can be seen, the absolute value of the slope of curve1116 is smaller than either of the slopes of curve 1112 or of curve1114. This indicates that variations of β_(f) will have little effect onthe area of the pattern produced on a surface from set of shots 1000,relative to set of shots 710 or to set of shots 800. This insensitivityto β_(f) is desirable, indicating that a more accurate pattern can beformed on the surface, in the face of manufacturing process variationsthat may affect β_(f). In one embodiment, the surface to which thecircular pattern is being transferred is a reticle which will be used inan optical lithographic process to transfer the pattern to a substratesuch as a silicon wafer. A more accurate pattern on the reticle mayproduce a more accurate pattern on the wafer, leading, for example, to ahigher wafer manufacturing yield.

In some embodiments of the invention, the adjustment of shot overlap,for example to minimize β_(f) sensitivity, may be part of a two stepprocess. In the first step, an initial set of shots is determined thatcan form a desired pattern on the surface. Shots in this initial set ofshots may overlap. This first step may comprise use of charged particlebeam simulation to determine the pattern that will be formed on thesurface. In the second step, shot overlap is adjusted to reducesensitivity to β_(f) variation. It is important that the process ofadjusting shot overlap to reduce β_(f) sensitivity not significantlychange the pattern shape on the surface, the dose margin, or othercriteria that affect the quality of the mask. Charged particle beamsimulation may also be used in the second step, to determine the patternthat will be produced on the surface for various values of β_(f). In theexample of FIG. 10A, the second step of adjusting shot overlap maycomprise one or more sub-steps. If charged particle beam simulation ofthe initial set of shots determines that additional shot overlap isrequired to reduce β_(f) sensitivity, then two exemplary sub-steps thatmay be used to accomplish this are as follows:

-   -   Move the inside edges of shots 1004, 1006, 1008 and 1010 to        increase overlap with shot 1002. Edge 1014 of shot 1004 is moved        in the positive “x” direction, edge 1016 of shot 1006 is moved        in the negative “y” direction, edge 1018 of shot 1008 is moved        in the negative “x” direction, and edge 1020 of shot 1010 is        moved in the positive “y” direction.    -   Move the outside edges of shots 1004, 1006, 1008 and 1010 in the        same direction that the inside edges of these shots were moved        in the previous sub-step. Movement of the outside edges is done        to prevent to prevent expansion of the pattern shape on the        surface due to the additional dosage provided by moving the        inside edges in the previous sub-step. The outside edges will        generally need to move less than the inside edges were moved.

The two sub-steps may be combined in practice. This example illustratesone technique for adjusting shot overlap while maintaining the integrityof the pattern that will be formed on the surface. In other embodimentsof this invention, determination of shots to produce a desired surfacepattern and adjustment of shot overlap to reduce β_(f) sensitivity maybe combined into a single step or process.

FIG. 10C illustrates another exemplary set of overlapping shots 1040that can form the circular pattern 702 on a surface. Set of shots 1040consists of seven shots: shot 1042, shot 1044, shot 1046, shot 1048,shot 1050, shot 1052, and shot 1054. Although each shot in set of shots1040 overlaps at least one other shot, in other embodiments, some shotsin a set of shots may not overlap other shots. In FIG. 10C, the areas ofshot overlap are illustrated as cross-hatched. The seven shot set ofshots 1040 may produce a pattern on the surface which more closelyapproximates circular pattern 702 than would a pattern produced by thefive shot set of shots 1000. In FIG. 11 graph 1100, curve 1118illustrates an example of the area of the pattern produced by set ofshots 1040 with varying values of β_(f). As can be seen, the absolutevalue of the slope of curve 1118, like the absolute value of the slopeof curve 1116, is less than either curve 1112 or curve 1114.

The near-zero slopes of graph 1100 curve 1116 and curve 1118 can beachieved by adjusting the amount of overlap in a set of shots producinga pattern such as pattern 702. An increasing area of overlap mayincrease the slope of the curve, and a decreasing amount of overlap maydecrease the slope of the curve. Also, a change in shot overlap near theperimeter of a pattern may affect the β_(f) sensitivity of the patternmore than a similar change in shot overlap further from the perimeter ofthe pattern. In some embodiments of this invention, rule-basedtechniques may be used to determine the proper shot configurations forreducing β_(f) sensitivity.

Shot overlap may also be used to reduce β_(f) dependency when aplurality of overlapping complex character projection shots are used toform a pattern, and when a combination of complex character projectionshots and VSB shots are used to form a pattern.

In another embodiment of this disclosure, one or more multi-beam shotsmay be used to form pattern 702, for example. Dosage of individualbeamlets in the multi-beam shot(s) may be modulated to, for example,provide a higher dosage to areas near the perimeter of the pattern 702than the dosage that is delivered to other parts of the pattern. Thesize of these areas of higher dosage may be enlarged or contracted,corresponding to an increase or decrease in shot overlap as in theprevious embodiment. The effect of the higher dosage on the pattern may,for example, be simulated using charged particle beam simulation forvarious values of β_(f). The size of the areas of higher dosage can bevaried, and the shape modified, to reduce the β_(f) sensitivity.

More generally, any type of charged particle beam lithography may beused, as long as higher dosage can be delivered to areas of the patternnear the pattern perimeter than to other areas of the pattern. The size,shape and specific location of these areas of higher dosage aredetermined to reduce β_(f) sensitivity. The size and shape of theseareas may be determined iteratively, using optimization techniques, orby using non-iterative techniques. In some embodiments, rule-basedtechniques may be used to determine the size, shape, and/or the locationof the areas of higher dosage.

The calculations described or referred to in this invention may beaccomplished in various ways. Generally, calculations may beaccomplished by in-process, pre-process or post-process methods.In-process calculation involves performing a calculation when itsresults are needed. Pre-process calculation involves pre-calculating andthen storing results for later retrieval during a subsequent processingstep, and may improve processing performance, particularly forcalculations that may be repeated many times. Calculations may also bedeferred from a processing step and then done in a later post-processingstep. An example of pre-process calculation is pre-calculating thechange in sensitivity of patterns of various types to changes in β_(f)for various amounts of shot overlap change. Another example ofpre-process calculation is a shot group, which is a pre-calculation ofdosage pattern information for one or more shots associated with a giveninput pattern or set of input pattern characteristics. The shot groupand the associated input pattern may be saved in a library ofpre-calculated shot groups, so that the set of shots comprising the shotgroup can be quickly generated for additional instances of the inputpattern, without pattern re-calculation. In some embodiments, thepre-calculation may comprise simulation of the dosage pattern that theshot group will produce on a resist-coated surface. In otherembodiments, the shot group may be determined without simulation, suchas by using correct-by-construction techniques. In some embodiments, thepre-calculated shot groups may be stored in the shot group library inthe form of a list of shots. In other embodiments, the pre-calculatedshot groups may be stored in the form of computer code that can generateshots for a specific type or types of input patterns. In yet otherembodiments, a plurality of pre-calculated shot groups may be stored inthe form of a table, where entries in the table correspond to variousinput patterns or input pattern characteristics such as pattern width,and where each table entry provides either a list of shots in the shotgroup, or information for how to generate the appropriate set of shots.Additionally, different shot groups may be stored in different forms inthe shot group library. In some embodiments, the dosage pattern which agiven shot group can produce may also be stored in the shot grouplibrary. In one embodiment, the dosage pattern may be stored as atwo-dimensional (X and Y) dosage map called a glyph.

FIG. 12 is a conceptual flow diagram 1250 of how to prepare a reticlefor use in fabricating a surface such as an integrated circuit on asilicon wafer. In a first step 1252, a physical design, such as aphysical design of an integrated circuit, is designed. This can includedetermining the logic gates, transistors, metal layers, and other itemsthat are required to be found in a physical design such as that in anintegrated circuit. The physical design may be rectilinear, partiallycurvilinear, or completely curvilinear. Next, in a step 1254, opticalproximity correction (OPC) is determined. In an embodiment of thisdisclosure, this can include taking as input a library of pre-calculatedshot groups from a shot group library 1288. This can also alternatively,or in addition, include taking as input a library of pre-designedcharacters 1280 including complex characters that are to be available ona stencil 1284 in a step 1266. In an embodiment of this disclosure, anOPC step 1254 may also include simultaneous optimization of shot countor write times, and may also include a fracturing operation, a shotplacement operation, a dose assignment operation, or may also include ashot sequence optimization operation, or other mask data preparationoperations, with some or all of these operations being simultaneous orcombined in a single step. The OPC step may create partially orcompletely curvilinear patterns. The output of the OPC step 1254 is amask design 1256.

Mask process correction (MPC) 1257 may optionally be performed on themask design 1256. MPC modifies the pattern to be written to the reticleso as to compensate for non-linear effects, such as effects associatedwith patterns smaller than about 100 nm in conventional opticallithographic masks. MPC may also be used to compensate for non-lineareffects affecting EUV masks. If MPC 1257 is performed, its outputbecomes the input for mask data preparation (MDP) step 1258.

In a step 1258, a mask data preparation (MDP) operation which mayinclude a fracturing operation, a shot placement operation, a doseassignment operation, or a shot sequence optimization may take place.MDP may use as input the mask design 1256 or the results of MPC 1257. Insome embodiments of the present invention, MPC may be performed as partof a fracturing or other MDP operation. Other corrections may also beperformed as part of fracturing or other MDP operation, the possiblecorrections including: forward scattering, resist diffusion, coulombeffect, etching, backward scattering, fogging, loading, resist charging,and EUV midrange scattering. The result of MDP step 1258 is a shot list1260. Either the OPC step 1254 or of the MDP step 1258, or a separateprogram 1286 can include pre-calculating one or more shot groups thatmay be used for a given input pattern, and storing this information in ashot group library 1288. Combining OPC and any or all of the variousoperations of mask data preparation in one step is contemplated in thisdisclosure. Mask data preparation step 1258, which may include afracturing operation, may also comprise a pattern matching operation tomatch pre-calculated shot groups to create a mask that matches closelyto the mask design. Mask data preparation step 1258 may also compriseincreasing dosage in select areas of the pattern, such as by varying theoverlap of shots or by using dose-modulated shots or multi-beam shotbeamlets, so that the resulting pattern or portions of the pattern onphotomask 1268 has reduced sensitivity to variations in β_(f). Mask datapreparation step 1258 may also comprise increasing the dose margin ofthe pattern on the photomask 1268. Mask data preparation may alsocomprise inputting patterns to be formed on a surface with the patternsbeing slightly different, selecting a set of characters to be used toform the number of patterns, the set of characters fitting on a stencilmask, the set of characters possibly including both complex and VSBcharacters, and the set of characters based on varying character dose orvarying character position or varying the beam blur radius or applyingpartial exposure of a character within the set of characters or dragginga character to reduce the shot count or total write time. A set ofslightly different patterns on the surface may be designed to producesubstantially the same pattern on a substrate. Also, the set ofcharacters may be selected from a predetermined set of characters. Inone embodiment of this disclosure, a set of characters available on astencil in a step 1280 that may be selected quickly during the maskwriting step 1262 may be prepared for a specific mask design. In thatembodiment, once the mask data preparation step 1258 is completed, astencil is prepared in a step 1284. In another embodiment of thisdisclosure, a stencil is prepared in the step 1284 prior to orsimultaneous with the MDP step 1258 and may be independent of theparticular mask design. In this embodiment, the characters available inthe step 1280 and the stencil layout are designed in step 1282 to outputgenerically for many potential mask designs 1256 to incorporate patternsthat are likely to be output by a particular OPC program 1254 or aparticular MDP program 1258 or particular types of designs thatcharacterizes the physical design 1252 such as memories, flash memories,system on chip designs, or particular process technology being designedto in physical design 1252, or a particular cell library used inphysical design 1252, or any other common characteristics that may formdifferent sets of slightly different patterns in mask design 1256. Thestencil can include a set of characters, such as a limited number ofcharacters that was determined in the step 1258.

In a proximity effect correction (PEC) refinement step 1262, dosages ofthe shots in shot list 1260 may be adjusted to account for one or morelong-range effects including backscatter, fogging, and loading, creatinga final shot list with adjusted dosages 1264. The final shot list withadjusted dosages 1264 is used to generate a surface in a mask writingstep 1266, which uses a charged particle beam writer such as an electronbeam writer system. Mask writing step 1266 may use stencil 1284, whichmay contain both VSB apertures and a plurality of complex characters.The electron beam writer system projects a beam of electrons onto asurface to form patterns on a surface such as a reticle, which is thenprocessed to become a photomask 1268. The completed photomask 1268 maythen be used in an optical lithography machine, which is shown in a step1270. Finally, in a step 1272, a substrate such as a silicon wafer isproduced. As has been previously described, in step 1280 characters maybe provided to the OPC step 1254 or the MDP step 1258. The step 1280also provides characters to a character and stencil design step 1282 ora shot group pre-calculation step 1286. The character and stencil designstep 1282 provides input to the stencil step 1284 and to the charactersstep 1280. The shot group generation step 1286 provides information tothe shot group library 1288. Also, the shot group pre-calculation step1286 may use as input the physical design 1252 or the mask design 1256,and may pre-calculate one or more shot groups, which are stored in ashot group library 1288.

Referring now to FIG. 13, another conceptual flow diagram 1350 of how toprepare a surface which is directly written on a substrate such as asilicon wafer is shown. In a first step 1352, a physical design, such asa physical design of an integrated circuit is determined. This may be anideal pattern that the designer wants transferred onto a substrate. Thephysical design may be rectilinear, partially curvilinear, or completelycurvilinear. Next, in a step 1358, proximity effect correction (PEC),and other data preparation (DP) steps such as fracturing are performedto prepare input data to a substrate writing device. The step 1358 maycomprise comprise increasing dosage in select areas of the pattern, suchas by varying the overlap of shots or by using dose-modulated shots ormulti-beam shot beamlets, so that the resulting pattern in substrateimage 1368 has reduced sensitivity to variations in β_(f). The step 1358may also comprise inputting possible glyphs or parameterized glyphs fromstep 1374, the glyphs being based on possibly overlapping VSB shots, andthe glyphs being determined using a calculation of varying a shot doseor varying a shot position in glyph generation step 1372. The step 1358may also comprise pattern matching to match glyphs to create a waferimage that matches closely to the physical design created in the step1352. Iterations, potentially including only one iteration where acorrect-by-construction “deterministic” calculation is performed, ofpattern matching, dose assignment, and equivalence checking may also beperformed. The result of step 1358 is a shot list 1360, which is thenused to prepare a wafer in a wafer writing step 1362. In one embodiment,wafer writing 1362 may be accomplished using an electron beam writersystem. The electron beam writer system projects a beam of electronsonto a surface to form patterns on substrate 1368 such as a siliconwafer. A shot group pre-calculation step 1372 provides information tothe shot group library 1374. Also, the shot group pre-calculation step1372 may use as input the physical design 1352, and may pre-calculateone or more shot groups, which are stored in a shot group library 1374.The step 1362 may include repeated application as required for eachlayer of processing, potentially with some processed using the methodsdescribed in association with FIG. 12, and others processed using themethods outlined above with respect to FIG. 13, or others produced usingany other wafer writing method to produce integrated circuits on thesilicon wafer.

The fracturing, mask data preparation, proximity effect correction andshot group creation flows described in this disclosure may beimplemented using general-purpose computers with appropriate computersoftware as computation devices. Due to the large amount of calculationsrequired, multiple computers or processor cores may also be used inparallel. In one embodiment, the computations may be subdivided into aplurality of 2-dimensional geometric regions for one or morecomputation-intensive steps in the flow, to support parallel processing.In another embodiment, a special-purpose hardware device, either usedsingly or in multiples, may be used to perform the computations of oneor more steps with greater speed than using general-purpose computers orprocessor cores. In one embodiment, the special-purpose hardware devicemay be a graphics processing unit (GPU). In another embodiment, theoptimization and simulation processes described in this disclosure mayinclude iterative processes of revising and recalculating possiblesolutions, so as to minimize either the total number of shots, or thetotal charged particle beam writing time, or some other parameter. Inyet another embodiment, an initial set of shots may be determined in acorrect-by-construction method, so that no shot modifications arerequired.

FIG. 14 illustrates an example of a computing hardware device 1400 thatmay be used to perform the calculations described in this disclosure.Computing hardware device 1400 comprises a central processing unit (CPU)1402, with attached main memory 1404. The CPU may comprise, for example,eight processing cores, thereby enhancing performance of any parts ofthe computer software that are multi-threaded. The size of main memory1404 may be, for example, 64 G-bytes. The CPU 1402 is connected to aPeripheral Component Interconnect Express (PCIe) bus 1420. A graphicsprocessing unit (GPU) 1414 is also connected to the PCIe bus. Incomputing hardware device 1400 the GPU 1414 may or may not be connectedto a graphics output device such as a video monitor. If not connected toa graphics output device, GPU 1414 may be used purely as a high-speedparallel computation engine. The computing software may obtainsignificantly-higher performance by using the GPU for a portion of thecalculations, compared to using CPU 1402 for all the calculations. TheCPU 1402 communicates with the GPU 1414 via PCIe bus 1420. In otherembodiments (not illustrated) GPU 1414 may be integrated with CPU 1402,rather than being connected to PCIe bus 1420. Disk controller 1408 mayalso be attached to the PCIe bus, with, for example, two disks 1410connected to disk controller 1408. Finally, a local area network (LAN)controller 1412 may also be attached to the PCIe bus, and providesGigabit Ethernet (GbE) connectivity to other computers. In someembodiments, the computer software and/or the design data are stored ondisks 1410. In other embodiments, either the computer programs or thedesign data or both the computer programs and the design data may beaccessed from other computers or file serving hardware via the GbEEthernet.

While the specification has been described in detail with respect tospecific embodiments, it will be appreciated that those skilled in theart, upon attaining an understanding of the foregoing, may readilyconceive of alterations to, variations of, and equivalents to theseembodiments. These and other modifications and variations to the presentmethods for fracturing, mask data preparation, proximity effectcorrection and optical proximity correction may be practiced by those ofordinary skill in the art, without departing from the spirit and scopeof the present subject matter, which is more particularly set forth inthe appended claims. Furthermore, those of ordinary skill in the artwill appreciate that the foregoing description is by way of exampleonly, and is not intended to be limiting. Steps can be added to, takenfrom or modified from the steps in this specification without deviatingfrom the scope of the invention. In general, any flowcharts presentedare only intended to indicate one possible sequence of basic operationsto achieve a function, and many variations are possible. Thus, it isintended that the present subject matter covers such modifications andvariations as come within the scope of the appended claims and theirequivalents.

What is claimed is:
 1. A method for manufacturing a surface using acharged particle beam lithographic process comprising a beam blur(β_(f)), the method comprising: determining a plurality of chargedparticle beam shots that will form a pattern on the surface by producinga charged particle dosage on the surface, wherein the formed patterncomprises a perimeter, and wherein the determining is performed usingone or more computing hardware processors; reducing a sensitivity of thepattern to a variation in the β_(f); and forming the pattern on thesurface with the plurality of shots.
 2. The method of claim 1 whereinthe pattern sensitivity to β_(f) is reduced by varying the chargedparticle surface dosage for a portion of the pattern.
 3. The method ofclaim 1 wherein the sensitivity comprises critical dimensionsensitivity.
 4. The method of claim 1 wherein the reducing comprisesusing charged particle beam simulation.
 5. The method of claim 4 whereinthe charged particle beam simulation includes at least one of a groupconsisting of forward scattering, backward scattering, resist diffusion,Coulomb effect, etching, fogging, loading and resist charging.
 6. Amethod for manufacturing an integrated circuit using an opticallithographic process, the optical lithographic process using a reticle,wherein the reticle is manufactured using a charged particle beamlithographic process comprising a beam blur (β_(f)), the methodcomprising: determining a plurality of charged particle beam shots thatwill form a pattern on the surface by producing a charged particledosage on the surface, wherein the formed pattern comprises a perimeter;reducing a sensitivity of the pattern to a variation in the β_(f); andforming the pattern on the surface with the plurality of shots.
 7. Themethod of claim 6 wherein the pattern sensitivity to β_(f) is reduced byvarying the charged particle surface dosage for a portion of thepattern.
 8. The method of claim 6 wherein the step of reducing comprisesusing charged particle beam simulation.
 9. The method of claim 8 whereinthe charged particle beam simulation includes at least one of a groupconsisting of forward scattering, backward scattering, resist diffusion,Coulomb effect, etching, fogging, loading and resist charging.
 10. Amethod for fracturing or mask data preparation or mask processcorrection for use with a charged particle beam lithographic processcomprising a beam blur (β_(f)), the method comprising: determining aplurality of charged particle beam shots that will form a pattern on asurface by producing a charged particle dosage on the surface, whereinthe formed pattern comprises a perimeter, and wherein the determining isperformed using one or more computing hardware processors; and reducinga sensitivity of the pattern to a variation in the β_(f).
 11. The methodof claim 10 wherein the pattern sensitivity to β_(f) is reduced byvarying the charged particle surface dosage for a portion of thepattern.
 12. The method of claim 11 wherein the varying comprisesincreasing the charged particle surface dosage in an area of the patternnear the perimeter of the pattern.
 13. The method of claim 12 whereinthe sensitivity comprises pattern area sensitivity of the pattern formedon the surface.
 14. The method of claim 13 wherein the reducingcomprises: simulating the pattern on the surface for a plurality ofvalues of β_(f); increasing the area of increased surface dosage if thesimulated pattern area decreases with increasing β_(f); and decreasingthe area of increased surface dosage if the simulated pattern areaincreases with increasing β_(f).
 15. The method of claim 10 wherein thesensitivity comprises critical dimension sensitivity.
 16. The method ofclaim 10 wherein shots in the plurality of shots comprise multi-beamshots.
 17. The method of claim 10 wherein shots in the plurality ofshots comprises variable shaped beam (VSB) shots.
 18. The method ofclaim 10 wherein some shots in the plurality of shots overlap eachother, and wherein the pattern sensitivity to β_(f) is reduced byvarying the overlap among shots in the plurality of shots.
 19. Themethod of claim 10 wherein the reducing comprises using an optimizationtechnique.
 20. The method of claim 19 wherein the sensitivity isminimized or nearly minimized, within a pre-determined range of β_(f).21. The method of claim 10 wherein the reducing comprises a rule-basedtechnique.
 22. The method of claim 10 wherein in the determining, dosemargin of the pattern on the surface is increased.
 23. The method ofclaim 10 wherein the pattern comprises a circular or nearly-circularpattern.
 24. The method of claim 10 wherein the surface is a reticle.25. The method of claim 10 wherein the reducing comprises using chargedparticle beam simulation.
 26. The method of claim 25 wherein the chargedparticle beam simulation includes at least one of a group consisting offorward scattering, backward scattering, resist diffusion, Coulombeffect, etching, fogging, loading and resist charging.
 27. A system forfracturing or mask data preparation or mask process correction for usewith a charged particle beam lithographic process comprising a beam blur(β_(f)), the system comprising: a device configured to determine aplurality of charged particle beam shots that will form a pattern on asurface by producing a charged particle dosage on the surface, whereinthe formed pattern comprises a perimeter; and a device configured toreduce a sensitivity of the pattern to variation in the β_(f).
 28. Thesystem of claim 27 wherein the pattern sensitivity to β_(f) is reducedby varying the charged particle surface dosage for a portion of thepattern.
 29. The system of claim 27 wherein the device configured toreduce performs charged particle beam simulation.